2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (ULIS)

April 3-5, 2017 - Athens, Greece

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Abstract Submission

Original 2-page abstracts with illustrations will be accepted for review in pdf format. Papers submitted for review will clearly state:

  • The purpose of the work
  • How and to what extent it advances the art
  • Specific new results and their impact

The degree to which the paper deals with these issues will affect the paper selection. The most frequent cause of rejection of submitted papers is a lack of new results. Only work that has not been previously published at the time of the Conference will be considered. Submission of a paper for review and subsequent acceptance is considered by the Committee as an agreement that the work will not be placed in the public domain prior to the Conference.

Template

The 2-page template can be found here.

Deadline

The abstracts should be submitted by January 20, 2017 January 29, 2017

Accepted Abstracts

The accepted abstracts will be published in a Proceedings book with an ISBN. All the accepted abstracts will be indexed in IEEE Xplore, with a DOI. Authors of accepted papers are requested to submit a 4-page final paper for publication in the conference proceedings.

Template

The template for the 4-page accepted abstract should comply with IEEE Xplore publication rules. A MS word template can be found here.Only abstracts that follow this template will be accepted.

Deadline

A 4-page follow-up paper delivered before April 3 April 28, 2017 will be published in IEEE Xplore Digital Library.

Talks & Posters Information

Talks

The duration of regular talks will be 15 mins, including the questions addressed by the audience. Invited talks will last 30 mins, including the questions addressed by the audience.

Posters

For the poster sessions the authors may use any material that fits in a 85cm(width) x 115cm (height) panel.

After Conference Publications

The authors of the best papers will be invited to submit a longer version for publication in a special issue of Solid-State Electronics.